From September 9-10, 2019, the China Semiconductor Packaging Test Technology and Market annual meeting was held in Wuxi, Jiangsu Province. The conference was sponsored by China Semiconductor Industry Association, Wuxi industry and Information Bureau, China Core Integrated Circuit Co., Ltd. and cosponsored by Jiangsu Changdian Technology Co., Ltd.

PhiChem’ Director of Sales for Electronic Materials, Mr. Wang Xianfeng gave a well-received speech on the performance challenges and solutions of solder balls interconnects for intelligent vehicles.  This talk was made at the special forum on Advanced Packaging Testing and Key Materials. The speech covered the company’s latest research results on the solder ball materials, and discussed the infinite possibility of the application of solder ball products in smart car applications. With the rapid development of high-end automotive applications, light, thin and highly-robust electronic products are more important than ever before.  Micro solder balls will become a mainstream interconnect technology for wafer packaging technology in the future. Ball mount technology can avoid the shortcomings of traditional technologies, effectively increasing I/O number, reducing spacing, simplifying process and reducing cost.